21-0147C参数引脚封装等应用资料
21-0147C Datasheet PDF
| 生产商 | 封装 | 功能应用 | 适应温度 | |
|---|---|---|---|---|
| MAXIM[Maxim Integrated Products] | PACKAGE OUTLINE, UDFN, 0.8mm |
21-0147C PDF | 最小°C | 最大°C |
- Dallas Semiconductor 21-0102
PACKAGE OUTLINE, 12,16L 3x3x0.90 - Maxim Integrated Products 21-0109B
PACKAGE OUTLINE, uMAX, EXPOSED - DALLAS[Dallas Semiconductor] 21-0110
PACKAGE OUTLINE, TQFP, 5x5x1.0mm - MAXIM[Maxim Integrated Products] 21-0114
PACKAGE OUTLINE, LEAD THIN SOT23, PROFILE) - MAXIM[Maxim Integrated Products] 21-0114B
PACKAGE OUTLINE, LEAD THIN SOT23, PROFILE) - Dallas Semiconducotr 21-0117G
PACKAGE OUTLINE, UCSP - MAXIM[Maxim Integrated Products] 21-0125A
PACKAGE OUTLINE - MAXIM Dallas Semiconductor 21-0132A
21-0132A - MAXIM Dallas Semiconductor 21-0136F
PACKAGE OUTLINE 1216L THIN 3x3x0.8mm - MAXIM[Maxim Integrated Products] 21-0139A
PACKAGE OUTLINE - MAXIM[Maxim Integrated Products] 21-0144B
PACKAGE OUTLINE - MAXIM[Maxim Integrated Products] 21-0146
PACKAGE OUTLINE TQFP, 10x10x1.0 - MAXIM[Maxim Integrated Products] 21-0146A
PACKAGE OUTLINE TQFP, 10x10x1.0 - MAXIM[Maxim Integrated Products] 21-0147C
PACKAGE OUTLINE, UDFN, 0.8mm - DALLAS[Dallas Semiconductor] 21-0159
21-0159